Experimental Analysis of High Temperature PEEK Materials on 3D Printing Test | |
Sun Xiaoyong1,2; Cao Liangcheng1,2; Ma Honglin1,2; Gao Peng1,2; Bai Zhanwei3; Li Cheng3 | |
2017 | |
会议录名称 | PROCEEDINGS OF 2017 9TH INTERNATIONAL CONFERENCE ON MEASURING TECHNOLOGY AND MECHATRONICS AUTOMATION (ICMTMA)
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页码 | 13-16 |
会议名称 | 9th International Conference on Measuring Technology and Mechatronics Automation (ICMTMA) |
会议日期 | JAN 14-15, 2017 |
会议地点 | Changsha, PEOPLES R CHINA |
出版地 | NEW YORK |
出版者 | IEEE |
摘要 | As a kind of semi crystalline thermoplastic engineering plastics, Polyetheretherketone (PEEK) has excellent mechanical properties and chemical stability. Aiming at the high temperature properties of PEEK, test and analysis of PEEK fused 3D printing performance was carried out by the fused deposition modeling(FDM), the experimental research date has been obtained by the effect of temperature on the mechanical properties and forming precision, the sheet forming. The result shows that adjusting the hot bed temperature, ambient temperature and filling ratio, it can improve the bonding strength, and it ultimately can improve the mechanical properties and the printing precision of PEEK. Compared to the PLA material, the maximum tensile strength of PEEK reached up to around 77Mpa, which was much larger than the tensile strength of PLA, and has good forming properties in thin layer parts. The analysis of this paper provides an effective basis for the analysis of high temperature 3D material PPEK printing, and provides a new solution for the performance control of high temperature material 3D printing. |
关键词 | PEEK Temperature effect Forming precision 3D printing |
ISSN | 2157-1473 |
DOI | 10.1109/ICMTMA.2017.11 |
收录类别 | CPCI-S |
语种 | 英语 |
WOS研究方向 | Automation & Control Systems ; Engineering |
WOS类目 | Automation & Control Systems ; Engineering, Electrical & Electronic ; Engineering, Mechanical |
WOS记录号 | WOS:000401696400004 |
原始文献类型 | Proceedings Paper |
引用统计 | |
文献类型 | 会议论文 |
条目标识符 | https://ir.cqcet.edu.cn/handle/39TD4454/4229 |
专题 | 重庆电子科技职业大学 |
作者单位 | 1.Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China; 2.Chongqing Key Lab Intelligent Mfg Technol & Syst, Chongqing 400714, Peoples R China; 3.Chongqing Vocat Inst Engn, Chongqing 402260, Peoples R China |
推荐引用方式 GB/T 7714 | Sun Xiaoyong,Cao Liangcheng,Ma Honglin,et al. Experimental Analysis of High Temperature PEEK Materials on 3D Printing Test[C]. NEW YORK:IEEE,2017:13-16. |
条目包含的文件 | 条目无相关文件。 |
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