| Atomic diffusion behavior in electromagnetic pulse welding | |
Li, Chengxiang1; Xu, Chennan1; Zhou, Yan1,2 ; Chen, Dan1; Wang, Xianmin1; Mi, Yan1
| |
| 2023 | |
| 发表期刊 | MATERIALS LETTERS
 |
| ISSN | 0167-577X |
| EISSN | 1873-4979 |
| 卷号 | 330 |
| 摘要 | This paper investigates the atomic diffusion behavior and bonding mechanism in a Cu-Al joint fabricated by electromagnetic pulse welding. The molecular dynamics simulation is proposed to investigate the atomic diffusion behavior. The equation of diffusion layer thickness is deduced to calculate the diffusion layer thickness according to the simulation results. The welding and transmission electron microscope experiments are carried out, and the simulation results are in good agreement with the experiments. There is a diffusion zone of amorphous layer at the bonding interface, but the diffusion thickness is narrow. So this work reveals that the inter-atomic bonding is not a major factor in electromagnetic pulse welding. © 2022 Elsevier B.V. |
| 关键词 | Aluminum alloys Atoms Binary alloys Copper alloys Electromagnetic pulse Molecular dynamics Welding Amorphous layer Atomic diffusions Bonding mechanism Diffusion behavior Diffusion layer thickness Diffusion zones Dynamics simulation Equation of diffusion Transmission electron Welding |
| DOI | 10.1016/j.matlet.2022.133242 |
| 收录类别 | EI ; SCIE |
| 语种 | 英语 |
| WOS研究方向 | Materials Science ; Physics |
| WOS类目 | Materials Science, Multidisciplinary ; Physics, Applied |
| WOS记录号 | WOS:000868274300006 |
| 出版者 | Elsevier B.V. |
| EI入藏号 | 20223912813418 |
| 原始文献类型 | Journal article (JA) |
| 出版地 | AMSTERDAM |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | https://ir.cqcet.edu.cn/handle/39TD4454/14157 |
| 专题 | 电子与物联网学院 |
| 作者单位 | 1.State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing; 400044, China; 2.School of Electronics and IoT, Chongqing College of Electronic Engineering, Chongqing; 401331, China |
| 推荐引用方式 GB/T 7714 | Li, Chengxiang,Xu, Chennan,Zhou, Yan,et al. Atomic diffusion behavior in electromagnetic pulse welding[J]. MATERIALS LETTERS,2023,330. |
| APA | Li, Chengxiang,Xu, Chennan,Zhou, Yan,Chen, Dan,Wang, Xianmin,&Mi, Yan.(2023).Atomic diffusion behavior in electromagnetic pulse welding.MATERIALS LETTERS,330. |
| MLA | Li, Chengxiang,et al."Atomic diffusion behavior in electromagnetic pulse welding".MATERIALS LETTERS 330(2023). |
| 条目包含的文件 | 条目无相关文件。 | |||||
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